Diffusion bonding of a Cu-Cr-Zr alloy to stainless steel and tungsten using nickel as an interlayer
dc.contributor.author | Batra, I. S. | |
dc.contributor.author | Kale, G. B. | |
dc.contributor.author | Saha, T. K. | |
dc.contributor.author | Ray, A. K. | |
dc.contributor.author | Derose, J. | |
dc.contributor.author | Krishnan, J. | |
dc.date.accessioned | 2021-07-09T10:29:34Z | |
dc.date.available | 2021-07-09T10:29:34Z | |
dc.date.issued | 2004 | |
dc.description.division | MSD;L&PTD;CDM | en |
dc.format.extent | 3640 bytes | |
dc.format.mimetype | text/html | |
dc.identifier.source | Materials Science and Engineering-A, 2004. Vol. 369 (42767): pp. 119-123 | en |
dc.identifier.uri | http://hdl.handle.net/123456789/23014 | |
dc.language.iso | en | en |
dc.subject | Diffusion bonding | en |
dc.subject | Cu-Cr-Zr alloy | en |
dc.subject | Tungsten | en |
dc.subject | Stainless steel | en |
dc.subject | EPMA | en |
dc.title | Diffusion bonding of a Cu-Cr-Zr alloy to stainless steel and tungsten using nickel as an interlayer | en |
dc.type | Article | en |