Batra, I. S.; Kale, G. B.; Saha, T. K.; Ray, A. K.; Derose, J.; Krishnan, J. (MSD;L&PTD;CDM)
Source
Materials Science and Engineering-A, 2004. Vol. 369 (42767): pp. 119-123
ABSTRACT
In the present work, diffusion bonding of Cu-1 wt.% Cr-0.1 wt.% Zr alloy to tungsten as well as to stainless steel 316 (SS) has been attempted using nickel as an interlayer. This could be achieved in a single step and the bonds were found to be metallurgically sound with the strength exceeding that of the sintered tungsten used in this work.