Elucidating microstructure of spinodal copper alloy through annealing

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dc.contributor.authorDas, A.
dc.contributor.authorVerma, V.
dc.contributor.authorBasak, C. B.
dc.date.accessioned2017-01-17T06:33:13Z
dc.date.available2017-01-17T06:33:13Z
dc.date.issued2016
dc.description.divisionMMD;G&AMDen
dc.format.extent3877 bytes
dc.format.mimetypetext/html
dc.identifier.sourceMaterials Characterization, 2016. Vol. 120: pp. 152-158en
dc.identifier.urihttp://hdl.handle.net/123456789/13960
dc.language.isoenen
dc.subjectMicrostructureen
dc.subjectGrain boundary engineeringen
dc.subjectElectron backscatter diffractionen
dc.subjectSpinodal copper alloyen
dc.subjectAnnealing twinen
dc.titleElucidating microstructure of spinodal copper alloy through annealingen
dc.typeArticleen

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