Elucidating microstructure of spinodal copper alloy through annealing

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Date

2016

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Abstract

Description

Keywords

Microstructure, Grain boundary engineering, Electron backscatter diffraction, Spinodal copper alloy, Annealing twin

Source

Materials Characterization, 2016. Vol. 120: pp. 152-158

URI

http://hdl.handle.net/123456789/13960

Collections

2016