Real time investigation of the effect of thermal expansion coefficient mismatch on film-substrate strain partitioning in Ag/Si systems

Das, D.Banu, N.Bisi, B.Srihari, V.Halder, R.2018-04-122018-04-122016Journal of Applied Physics, 2016. Vol. 120: Article no. 135301http://hdl.handle.net/123456789/160254737 bytestext/htmlenReal time investigationthermal expansion coefficientfilm-substrate strain partitioningAg/Si systemsReal time investigation of the effect of thermal expansion coefficient mismatch on film-substrate strain partitioning in Ag/Si systemsArticle