Das, A.Verma, V.Basak, C. B.2017-01-172017-01-172016Materials Characterization, 2016. Vol. 120: pp. 152-158http://hdl.handle.net/123456789/139603877 bytestext/htmlenMicrostructureGrain boundary engineeringElectron backscatter diffractionSpinodal copper alloyAnnealing twinElucidating microstructure of spinodal copper alloy through annealingArticle