Shastry, V. V.Maji, B.Krishnan, M.Ramamurty, U.2012-03-092012-03-092011Journal of Materials Research, 2011. Vol. 26 (19): pp. 2484-2492http://hdl.handle.net/123456789/58394444 bytestext/htmlenHigh-temperature deformation processing mapsNiTiCu shape memory alloythermomechanical processingUniaxial compression experimentsTwo-dimensional power dissipation efficiencyHigh-temperature deformation processing maps for a NiTiCu shape memory alloyArticle