Choudhary, R. K.Laik, A.Mishra, P.2017-09-292017-09-292017Journal of Materials Engineering and Performance, 2017. Vol. 26 (3): pp. 1085-1100http://hdl.handle.net/123456789/150334598 bytestext/htmlenbrazing, copperelectronfailure analysisjoiningmicroscopystainlesssteelMicrostructure Evolution During Stainless Steel-Copper Vacuum Brazing with a Ag/Cu/Pd Filler Alloy: Effect of Nickel PlatingArticle