Real time investigation of the effect of thermal expansion coefficient mismatch on film-substrate strain partitioning in Ag/Si systems

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dc.contributor.authorDas, D.
dc.contributor.authorBanu, N.
dc.contributor.authorBisi, B.
dc.contributor.authorSrihari, V.
dc.contributor.authorHalder, R.
dc.date.accessioned2018-04-12T05:55:47Z
dc.date.available2018-04-12T05:55:47Z
dc.date.issued2016
dc.description.divisionHP&SRPD;MSDen
dc.format.extent4737 bytes
dc.format.mimetypetext/html
dc.identifier.sourceJournal of Applied Physics, 2016. Vol. 120: Article no. 135301en
dc.identifier.urihttp://hdl.handle.net/123456789/16025
dc.language.isoenen
dc.subjectReal time investigationen
dc.subjectthermal expansion coefficienten
dc.subjectfilm-substrate strain partitioningen
dc.subjectAg/Si systemsen
dc.titleReal time investigation of the effect of thermal expansion coefficient mismatch on film-substrate strain partitioning in Ag/Si systemsen
dc.typeArticleen

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