Effect of ultrathin Cu buffer layer on interfaces of Co/Ti multilayer for use in water-window region
dc.contributor.author | Sarkar, P. | |
dc.contributor.author | Biswas, A. | |
dc.contributor.author | De, R. | |
dc.contributor.author | Rao, K. D. | |
dc.contributor.author | Donthula, H. | |
dc.contributor.author | Bhattacharyya, D. | |
dc.date.accessioned | 2020-02-24T11:15:49Z | |
dc.date.available | 2020-02-24T11:15:49Z | |
dc.date.issued | 2019 | |
dc.description.division | A&MPD;MSD | en |
dc.format.extent | 4148 bytes | |
dc.format.mimetype | text/html | |
dc.identifier.source | AIP Conference Proceedings, 2019. Vol. 2115: Article no. 030297 | en |
dc.identifier.uri | http://hdl.handle.net/123456789/20348 | |
dc.language.iso | en | en |
dc.subject | ultrathin Cu buffer layer | en |
dc.subject | interfaces of Co/Ti multilayer | en |
dc.subject | water-window region | en |
dc.subject | cross-sectional transmission electron microscopy (TEM) | en |
dc.title | Effect of ultrathin Cu buffer layer on interfaces of Co/Ti multilayer for use in water-window region | en |
dc.type | Article | en |