Microstructure Evolution During Stainless Steel-Copper Vacuum Brazing with a Ag/Cu/Pd Filler Alloy: Effect of Nickel Plating

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dc.contributor.authorChoudhary, R. K.
dc.contributor.authorLaik, A.
dc.contributor.authorMishra, P.
dc.date.accessioned2017-09-29T06:35:03Z
dc.date.available2017-09-29T06:35:03Z
dc.date.issued2017
dc.description.divisionMP&CED;MSDen
dc.format.extent4598 bytes
dc.format.mimetypetext/html
dc.identifier.sourceJournal of Materials Engineering and Performance, 2017. Vol. 26 (3): pp. 1085-1100en
dc.identifier.urihttp://hdl.handle.net/123456789/15033
dc.language.isoenen
dc.subjectbrazing, copperen
dc.subjectelectronen
dc.subjectfailure analysisen
dc.subjectjoiningen
dc.subjectmicroscopyen
dc.subjectstainlessen
dc.subjectsteelen
dc.titleMicrostructure Evolution During Stainless Steel-Copper Vacuum Brazing with a Ag/Cu/Pd Filler Alloy: Effect of Nickel Platingen
dc.typeArticleen

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