Electrochemical behavior of pitting corrosion of a Ni film, grown on Si substrate by sputtering, prepassivated in a chloride-free sulfuric acid solution and subsequently exposed to chloride above the pitting potential is reported. Specular and off-specular unpolarized neutron reflectometry and Atomic Force Microscopy (AFM) techniques have been used to determine the depth profile of scattering length density and morphology of as-deposited as well as corroded sample.  Specular neutron reflectometry measurement of the film after corrosion shows density degradation along the thickness of film. The density profile as a function of depth, maps the growth of pitting and void networks due to corrosion. The AFM and offspecular neutron reflectivity measurements has suggested that the morphology of the film remains same after exposure of the film in chloride solution.