BARC/PUB/2011/0550

 
 

Role of vapor pressure of 1,4-bis(trimethylsilyl)benzene in developing silicon carbide thin film using a plasma-assisted liquid injection chemical vapor deposition process

 
     
 
Author(s)

Selvakumar, J.; Sathiyamoorthy, D.; Nagaraja, K. S.

Source

Surface & Coatings Technology, 2011. Vol. 205 (11): pp. 3493-3498

ABSTRACT

The temperature dependence equilibrium vapor pressure (pe)T data yielded a straight line when ln(pe) was plotted against the reciprocal temperature in the range of 312.82–367.12 K, leading to a standard enthalpy of sublimation (ΔsubH°) value of 68.2±0.8 kJ mol−1 for 1,4-bis(trimethylsilyl)benzene (TMSB). From the depression of the melting point in the DTA-mode, the standard enthalpy of fusion (ΔfusH°) was found to be 26.9±2.5 kJ mol−1. A thin film of silicon carbide was grown on graphite substrate at 573 K using TMSB or bis (trimethylsilyl)acetylene as precursors. The deposited films were characterized by scanning electron microscopy and  energy dispersive X-ray analysis for their composition and morphology.

 
 
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